19. A.I. Taub and F. Spaepen, "Iso-configurational
flow of amorphous
Pd82Si18," Scripta Metallurgica 13:195-198 (1979).
74. T.W. Wu and F. Spaepen, "Embrittlement of a metallic glass," Mechanical
Behavior of Rapidly Solidified Materials (Warrendale, PA: The Metallurgical
Society of AIME, 1986), pp. 293-305.
120. T.W. Wu and F. Spaepen, "The relation between embrittlement and structural
relaxation of an amorphous metal," Philosophical Magazine B 61:739-750 (1990).
136. C.A. Volkert and F. Spaepen, "A comparison of viscous flow in sputtered
and melt-quenched amorphous Pd-Si alloys," Scripta Metallurgica 24:463-468
(1990).
167. J.A. Ruud, D. Josell, F. Spaepen and A.L. Greer, "A new method for
tensile testing of thin films,"Journal of Materials Research 8:112-117 (1993).
168. A. Witvrouw and F. Spaepen, "Determination of the plane stress elastic
constants of thin films from substrate curvature measurements: Applications
to amorphous metals," Journal of Applied Physics 73:7344-7350 (1993).
175. D. Josell and F. Spaepen, "Determination of the interfacial tension
by zero creep experiments on multilayers—II. Experiment," Acta Metallurgica
41:3017-3027 (1993).
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190. E.P. Barth, F. Spaepen, R. Bye, S.K. Das, "Influence of processing
parameters on the ductile-to-brittle transition temperature of an Fe-Si-B
metallic glass," Acta Materialia, 45:423-428 (1997).
196. H. Huang and F. Spaepen, "Measurement of Young's modulus and Poisson's
ratio of free-standing Ag/Cu multilayered thin films," Materials Research
Society Symposia Proceedings (Pittsburgh, PA: Materials Research Society,
1996) 405:501-505.
201. A.L. Shull and F. Spaepen, "Measurements of stress during vapor deposition
of copper and silver thin films and multilayers," Journal of Applied Physics,
80:6243-6256 (1996).
218. H. Huang and F. Spaepen, "Tensile testing of free-standing Cu, Ag
and Al thin films and Ag/Cu multilayers", Acta Materialia 48:3261-3269 (2000).
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239. D.Y.W. Yu and F. Spaepen, "The yield strength of thin copper films on Kapton", Journal of Applied Physics, 95:2991-2997 (2004).
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