My research concerns the mechanical behavior of multilayered structures, e.g. thin film semiconductor devices in integrated circuits and MEM devices. Although the stiffness, hardness, fracture and adhesion of a wide variety of thin film materials is involved, the work has been heavily focused on the mechanical behavior of organosilicate glass (OSG) coatings, which is an innovative dielectric material used as inter-metal-dielectric in current and future advanced integrated circuits. The structure-property relationship and environmental effects on fracture of OSG films are the key issues being tackled. For more information, please visit my projects webpage.